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型号/品牌/封装
品类/描述
库存
价格(含税)
资料
  • 品牌: Molex (莫仕)
    封装:
    Through Hole
    品类: 连接器
    描述:
    Conn Header 28POS 0.1r/a Gold
    2681
    5-49
    19.9602
    50-199
    19.1072
    200-499
    18.6295
    500-999
    18.5101
    1000-2499
    18.3907
    2500-4999
    18.2542
    5000-7499
    18.1689
    ≥7500
    18.0836
  • 品牌: Molex (莫仕)
    封装:
    Through Hole
    品类: 连接器
    描述:
    Conn Header 31POS 0.1r/a Gold
    2818
    5-49
    22.1949
    50-199
    21.2464
    200-499
    20.7152
    500-999
    20.5825
    1000-2499
    20.4497
    2500-4999
    20.2979
    5000-7499
    20.2031
    ≥7500
    20.1082
  • 品牌: Molex (莫仕)
    封装:
    Through Hole
    品类: 连接器与适配器
    描述:
    CONN HEADER 80POS .100 VERT GOLD
    8831
    20-49
    0.0000
    50-99
    0.0000
    100-299
    0.0000
    300-499
    0.0000
    500-999
    0.0000
    1000-4999
    0.0000
    5000-9999
    0.0000
    ≥10000
    0.0000
  • 品牌: Molex (莫仕)
    封装:
    Through Hole
    品类: 连接器与适配器
    描述:
    Conn Shrouded Header HDR 6POS 2.54mm Solder RA Thru-Hole Tube
    1240
    20-49
    0.0000
    50-99
    0.0000
    100-299
    0.0000
    300-499
    0.0000
    500-999
    0.0000
    1000-4999
    0.0000
    5000-9999
    0.0000
    ≥10000
    0.0000
  • 品牌: Molex (莫仕)
    封装:
    Through Hole
    品类: 连接器与适配器
    描述:
    CONN HEADER 48POS .100 VERT GOLD
    6773
    20-49
    0.0000
    50-99
    0.0000
    100-299
    0.0000
    300-499
    0.0000
    500-999
    0.0000
    1000-4999
    0.0000
    5000-9999
    0.0000
    ≥10000
    0.0000
  • 品牌: Molex (莫仕)
    封装:
    Through Hole
    品类: 连接器与适配器
    描述:
    CONN HEADER MICROSHUNT 22POS TIN
    1507
    20-49
    0.0000
    50-99
    0.0000
    100-299
    0.0000
    300-499
    0.0000
    500-999
    0.0000
    1000-4999
    0.0000
    5000-9999
    0.0000
    ≥10000
    0.0000
  • 品牌: Molex (莫仕)
    封装:
    Through Hole
    品类: 连接器与适配器
    描述:
    2.00毫米( .079 “ )间距VHDM®板对板背板头,垂直, 6排, PinEnd版本, 60电路,引脚长度4.25毫米( .167 ” ) 2.00mm (.079") Pitch VHDM® Board-to-Board Backplane Header, Vertical, 6-Row, PinEnd Version, 60 Circuits, Pin Length 4.25mm (.167")
    1971
    20-49
    0.0000
    50-99
    0.0000
    100-299
    0.0000
    300-499
    0.0000
    500-999
    0.0000
    1000-4999
    0.0000
    5000-9999
    0.0000
    ≥10000
    0.0000
  • 品牌: Molex (莫仕)
    封装:
    Through Hole
    品类: 连接器与适配器
    描述:
    1.85毫米由1.85毫米( 0.073由0.073 )间距5双GbX®背板连接器系统,右导头, 100电路,金(Au ) 0.76μm ( 30μ ) ,引脚长度3.55毫米( 0.140 ) 1.85mm by 1.85mm (.073 by .073) Pitch 5-Pair GbX® Backplane Connector System, Right Guide Header, 100 Circuits, Gold (Au) 0.76μm (30μ), Pin Length 3.55mm (.140)
    1969
    20-49
    0.0000
    50-99
    0.0000
    100-299
    0.0000
    300-499
    0.0000
    500-999
    0.0000
    1000-4999
    0.0000
    5000-9999
    0.0000
    ≥10000
    0.0000
  • 品牌: Molex (莫仕)
    封装:
    Through Hole
    品类: 连接器
    描述:
    薄型DIMM插槽 Low Profile DIMM Socket
    1995
    5-49
    21.5865
    50-199
    20.6640
    200-499
    20.1474
    500-999
    20.0183
    1000-2499
    19.8891
    2500-4999
    19.7415
    5000-7499
    19.6493
    ≥7500
    19.5570
  • 品牌: Molex (莫仕)
    封装:
    Through Hole
    品类: 连接器与适配器
    描述:
    2.00毫米( .079 “ )间距VHDM®板对板背板头,垂直, 8排,导针信号模块,针端版本, 80电路,引脚长度6.25毫米( 0.246 ” ) 2.00mm (.079") Pitch VHDM® Board-to-Board Backplane Header, Vertical, 8-Row,Guide Pin Signal Module, Pin End Version, 80 Circuits, Pin Length 6.25mm (.246")
    7152
    20-49
    0.0000
    50-99
    0.0000
    100-299
    0.0000
    300-499
    0.0000
    500-999
    0.0000
    1000-4999
    0.0000
    5000-9999
    0.0000
    ≥10000
    0.0000
  • 品牌: Molex (莫仕)
    封装:
    Through Hole
    品类: 连接器与适配器
    描述:
    2.54毫米( .100“ )间距DIN 41612 ř女式插座,直角,通孔, 0.60μm ( 24μ ” )选择金(Au ),电镀,电路96 2.54mm (.100") Pitch DIN 41612 R Style Female Receptacle, Right Angle, Through Hole, 0.60μm (24μ") Selective Gold (Au) Plating, 96 Circuits
    3992
    20-49
    0.0000
    50-99
    0.0000
    100-299
    0.0000
    300-499
    0.0000
    500-999
    0.0000
    1000-4999
    0.0000
    5000-9999
    0.0000
    ≥10000
    0.0000
  • 品牌: Molex (莫仕)
    封装:
    Through Hole
    品类: 连接器与适配器
    描述:
    2.00毫米( .079 “ )间距VHDM®板对板背板头,垂直, 6排, PinEnd版本, 150电路引脚长度4.75毫米( .187 ” ) 2.00mm (.079") Pitch VHDM® Board-to-Board Backplane Header, Vertical, 6-Row, PinEnd Version, 150 Circuits, Pin Length 4.75mm (.187")
    5977
    20-49
    0.0000
    50-99
    0.0000
    100-299
    0.0000
    300-499
    0.0000
    500-999
    0.0000
    1000-4999
    0.0000
    5000-9999
    0.0000
    ≥10000
    0.0000
  • 品牌: Molex (莫仕)
    封装:
    Through Hole
    品类: 连接器与适配器
    描述:
    2.00毫米( .079 “ )间距VHDM®精简版板对板背板头,垂直, 8 RowOpen信号模块, 80回路,引脚长度6.25毫米( 0.246 ” ) 2.00mm (.079") Pitch VHDM® Lite Board-to-Board Backplane Header, Vertical, 8-RowOpen Signal Module, 80 circuits, Pin Length 6.25mm (.246")
    8957
    1-9
    72.6915
    10-99
    69.5310
    100-249
    68.9621
    250-499
    68.5196
    500-999
    67.8243
    1000-2499
    67.5083
    2500-4999
    67.0658
    ≥5000
    66.6866
  • 品牌: Molex (莫仕)
    封装:
    Through Hole
    品类: 连接器与适配器
    描述:
    2.00毫米( .079 “ )间距VHDM®精简版板对板背板头,垂直, 8 RowOpen信号模块, 200电路引脚长度5.15毫米( .203 ” ) 2.00mm (.079") Pitch VHDM® Lite Board-to-Board Backplane Header, Vertical, 8-RowOpen Signal Module, 200 circuits, Pin Length 5.15mm (.203")
    6427
    20-49
    0.0000
    50-99
    0.0000
    100-299
    0.0000
    300-499
    0.0000
    500-999
    0.0000
    1000-4999
    0.0000
    5000-9999
    0.0000
    ≥10000
    0.0000
  • 品牌: Molex (莫仕)
    封装:
    Through Hole
    品类: 连接器与适配器
    描述:
    1.85由1.85毫米( 0.073由0.073 “ )间距的GbX *背板连接器系统在2 , 3 , 4和5对列 1.85 by 1.85mm (.073 by .073”) Pitch GbX* Backplane Connector System in 2, 3, 4 and 5-Pair Columns
    6322
    1-9
    69.1840
    10-99
    66.1760
    100-249
    65.6346
    250-499
    65.2134
    500-999
    64.5517
    1000-2499
    64.2509
    2500-4999
    63.8298
    ≥5000
    63.4688
  • 品牌: Molex (莫仕)
    封装:
    Through Hole
    品类: 电子元器件分类
    描述:
    Header Connector, PCB Mount, RECEPT, 40Contacts, PIN, 0.1 Pitch, PC TAIL Terminal
    8796
    5-49
    15.2100
    50-199
    14.5600
    200-499
    14.1960
    500-999
    14.1050
    1000-2499
    14.0140
    2500-4999
    13.9100
    5000-7499
    13.8450
    ≥7500
    13.7800
  • 品牌: Molex (莫仕)
    封装:
    Through Hole
    品类: 连接器与适配器
    描述:
    2.54毫米( .100 )间距DIN 41612 C类公头,直角,通孔, 0.60μm ( 24μ )选择金(Au )镀层, 16电路,无需安装夹 2.54mm (.100) Pitch DIN 41612 C Style Male Header, Right Angle, Through Hole, 0.60μm (24μ) Selective Gold (Au) Plating, 16 Circuits, without Mounting Clips
    8548
    5-49
    27.2727
    50-199
    26.1072
    200-499
    25.4545
    500-999
    25.2914
    1000-2499
    25.1282
    2500-4999
    24.9417
    5000-7499
    24.8252
    ≥7500
    24.7086
  • 品牌: Molex (莫仕)
    封装:
    Through Hole
    品类: 连接器
    描述:
    可插拔接线端子 3.5MM HOR PCB HDR 14 CIRCUITS
    8899
    5-49
    24.3711
    50-199
    23.3296
    200-499
    22.7464
    500-999
    22.6006
    1000-2499
    22.4547
    2500-4999
    22.2881
    5000-7499
    22.1840
    ≥7500
    22.0798
  • 品牌: Molex (莫仕)
    封装:
    Through Hole
    品类: 连接器
    描述:
    可插拔接线端子 3.5MM HOR PCB HDR 7 CIRCUITS
    2474
    10-99
    8.0160
    100-499
    7.6152
    500-999
    7.3480
    1000-1999
    7.3346
    2000-4999
    7.2812
    5000-7499
    7.2144
    7500-9999
    7.1610
    ≥10000
    7.1342
  • 品牌: Molex (莫仕)
    封装:
    Through Hole
    品类: 连接器与适配器
    描述:
    2.00 2.25毫米( .079由0.089 “ )间距5排, 6排和8排VHDM- HSD模块到背板连接器系统 2.00 by 2.25mm (.079 by .089") Pitch 5-Row, 6-Row and 8-Row VHDM-HSD Module-to-Backplane Connector System
    5742
    1-9
    377.1655
    10-49
    367.3264
    50-99
    359.7831
    100-199
    357.1593
    200-499
    355.1915
    500-999
    352.5678
    1000-1999
    350.9279
    ≥2000
    349.2881
  • 品牌: Molex (莫仕)
    封装:
    Through Hole
    品类: 电子元器件分类
    描述:
    2.54毫米( .100“ )间距C- Grid®分离式接头,有很高的知名度,双排,直角, 4回路, 6.10毫米( .240 ” )配合针脚长度,锡(Sn )镀层 2.54mm (.100") Pitch C-Grid® Breakaway Header, High Profile, Dual Row, Right Angle, 4 Circuits, 6.10mm (.240") Mating Pin Length, Tin (Sn) Plating
    6939
    1-9
    59.9380
    10-99
    57.3320
    100-249
    56.8629
    250-499
    56.4981
    500-999
    55.9248
    1000-2499
    55.6642
    2500-4999
    55.2993
    ≥5000
    54.9866
  • 品牌: Molex (莫仕)
    封装:
    Through Hole
    品类: 连接器与适配器
    描述:
    2.00毫米( .079 “ )间距HDM®板对板背板头,垂直, SMC , SolderTail ,导针选项, 72电路 2.00mm (.079") Pitch HDM® Board-to-Board Backplane Header, Vertical, SMC, SolderTail, Guide Pin Option, 72 Circuits
    6732
    1-9
    180.5385
    10-49
    175.8288
    50-99
    172.2180
    100-199
    170.9621
    200-499
    170.0202
    500-999
    168.7643
    1000-1999
    167.9793
    ≥2000
    167.1944
  • 品牌: Molex (莫仕)
    封装:
    Through Hole
    品类: 连接器
    描述:
    顶盖组件 HEADER ASSEMBLY
    7888
    5-24
    5.4540
    25-49
    5.0500
    50-99
    4.7672
    100-499
    4.6460
    500-2499
    4.5652
    2500-4999
    4.4642
    5000-9999
    4.4238
    ≥10000
    4.3632
  • 品牌: Molex (莫仕)
    封装:
    Through Hole
    品类: 连接器与适配器
    描述:
    2.00毫米( .079 “ )间距HDM板对板堆垛头,高层垂直, SMC 2.00mm (.079") Pitch HDM Board-to-Board Stacking Header, High Rise Vertical, SMC
    6500
    20-49
    0.0000
    50-99
    0.0000
    100-299
    0.0000
    300-499
    0.0000
    500-999
    0.0000
    1000-4999
    0.0000
    5000-9999
    0.0000
    ≥10000
    0.0000
  • 品牌: Molex (莫仕)
    封装:
    Through Hole
    品类: 连接器
    描述:
    2.00毫米( 0.079 )间距的Milli-电网™接头,垂直,通孔,罩,无铅, 8电路, 0.76μm ( 30μ ),金(Au )电镀,中心极化槽 2.00mm (.079) Pitch Milli-Grid™ Header, Vertical, Through Hole, Shrouded, Lead-free, 8 Circuits, 0.76μm (30μ) Gold (Au) Plating, Center Polarization Slot
    5365
    5-49
    12.0159
    50-199
    11.5024
    200-499
    11.2148
    500-999
    11.1430
    1000-2499
    11.0711
    2500-4999
    10.9889
    5000-7499
    10.9376
    ≥7500
    10.8862
  • 品牌: Molex (莫仕)
    封装:
    Through Hole
    品类: 连接器
    描述:
    顶盖组件 HEADER ASSEMBLY
    4710
    10-99
    7.8240
    100-499
    7.4328
    500-999
    7.1720
    1000-1999
    7.1590
    2000-4999
    7.1068
    5000-7499
    7.0416
    7500-9999
    6.9894
    ≥10000
    6.9634
  • 品牌: Molex (莫仕)
    封装:
    Through Hole
    品类: 连接器与适配器
    描述:
    2.00毫米( .079 “ )间距HDM®板对板背板头,垂直, SMC ,压接,导柱位置A,偏光关键位置d , 72电路 2.00mm (.079") Pitch HDM® Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location A, Polarizing Key Position D, 72 Circuits
    7565
    1-9
    344.9195
    10-49
    335.9216
    50-99
    329.0232
    100-199
    326.6238
    200-499
    324.8242
    500-999
    322.4248
    1000-1999
    320.9251
    ≥2000
    319.4255
  • 品牌: Molex (莫仕)
    封装:
    Through Hole
    品类: 连接器
    描述:
    Conn FPC Connector SKT 10POS 2.5mm Solder RA Thru-Hole Tray
    1782
    20-49
    0.0000
    50-99
    0.0000
    100-299
    0.0000
    300-499
    0.0000
    500-999
    0.0000
    1000-4999
    0.0000
    5000-9999
    0.0000
    ≥10000
    0.0000
  • 品牌: Molex (莫仕)
    封装:
    Through Hole
    品类: 连接器与适配器
    描述:
    集管和线壳 HEADER 31POS .100 VERT GOLD
    3983
    10-99
    8.2080
    100-499
    7.7976
    500-999
    7.5240
    1000-1999
    7.5103
    2000-4999
    7.4556
    5000-7499
    7.3872
    7500-9999
    7.3325
    ≥10000
    7.3051
  • 品牌: Molex (莫仕)
    封装:
    Through Hole
    品类: 连接器
    描述:
    Conn FFC/FPC Connector SKT 13POS 2.5mm Solder ST Thru-Hole Tray
    5532
    5-49
    15.5610
    50-199
    14.8960
    200-499
    14.5236
    500-999
    14.4305
    1000-2499
    14.3374
    2500-4999
    14.2310
    5000-7499
    14.1645
    ≥7500
    14.0980

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